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Images
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Scientists Discover New Atomic Technique to Charge Memory Chips
Date added: 22 Mar 2013
Optical image of a typical ionic liquid (IL) gated device with a droplet of IL on top of the gate electrode and the oxide channel. The gold squares are pads used to make contact to the device via wire-bonding. On right is the magnified image of the device showing the channel (brownish yellow) and the gold electrical contacts (bright yellow). The contacts on the right and left of the channel are the source and drain contacts. The four other contact are used for 4-wire resistance & Hall measurements. (Credit: IBM)
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MRSA biofilm disrupted by hydrogel
Date added: 24 Jan 2013
On the left is a mature and healthy MRSA biofilm. After the hydrogel is applied, the biofilm is destroyed as seen on the right. The small portion of cells left have drastically disrupted membrane, preventing resistance. This type of biofilm disruption has not been reported in other antimicrobial hydrogels/synthetic polymers. Photo Credit: IBN
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Polymer solution in gel form
Date added: 24 Jan 2013
The polymer solution, shown above in a remoldable gel form after heated to body temperature, is injectable for targeted treatment of bacterial infections and causes no adverse side effects. Photo Credit: IBN
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Polymer solution is ninety-percent water
Date added: 24 Jan 2013
The polymer solution is free flowing (b, d) at room temperature (71 degrees F). When heated to body temperature (98.6 degrees F), the polymers self-assemble into a cross-linked network, causing the solution to form a gel (c, e). Photo Credit: IBM
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Cross-sectional view of an IBM Silicon Nanophotonics chip combining optical and electrical circuits
Date added: 10 Dec 2012
An IBM 90nm Silicon Integrated Nanophotonics technology is capable of integrating a photodetector (red feature on the left side of the cube) and modulator (blue feature on the right side) fabricated side-by-side with silicon transistors ( red sparks on the far right). Silicon Nanophotonics circuits and silicon transistors are interconnected with nine levels of yellow metal wires.
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IBM SEM of carbon nanotube substrate
Date added: 28 Oct 2012
IBM SEM image of carbon nanotubes deposited on a trench coated in hafnium oxide (HfO2) showing extremely high density and excellent selectivity (scale bar: 2 μm). Credit: IBM
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IBM carbon nanotubes in solution
Date added: 28 Oct 2012
IBM researcher Hongsik Park observes different solutions of carbon nanotubes. Carbon nanotubes, borne out of chemistry, have largely been laboratory curiosities as far as microelectronic applications are concerned. Carbon nanotubes naturally come as a mix of metallic and semiconducting species and need to be placed perfectly on the wafer surface to make electronic circuits. For device operation, only the semiconducting kind of tubes is useful which requires essentially complete removal of the metallic ones to prevent errors in circuits. (Credit: IBM)
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IBM 3D Superconducting quantum bit
Date added: 28 Feb 2012
A picture of IBM’s “3D” superconducting qubit device where a qubit (about 1mm in length) is suspended in the center of the cavity on a small Sapphire chip. The cavity is formed by closing the two halves, and measurements are done by passing microwave signals to the connectors. Despite the apparent large feature size (the cavity is about 1.5 inches wide) for this single qubit demonstration, the team believes it is possible to scale such a system to hundreds or thousands of qubits.
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IBM 2D Superconducting quantum bit
Date added: 28 Feb 2012
A picture of the Silicon chip housing a total of three qubits. The chip is back-mounted on a PC board and connects to I/O coaxial lines via wire bonds (scale: 8mm x 4mm). A larger assembly of such qubits and resonators are envisioned to be used for a scalable architecture.
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IBM CMOS Integrated Silicon Nanophotonics Technology
Date added: 01 Dec 2010
IBM's new CMOS Integrated Silicon Nanophotonics chip technology integrates electrical and optical devices on the same piece of silicon, enabling computer chips to communicate using pulses of light (instead of electrical signals).
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IBM CMOS Integrated Silicon Nanophotonics Technology
Date added: 01 Dec 2010
IBM has unveiled a new chip technology, called CMOS Integrated Silicon Nanophotonics chip technology, which enables a 10X improvement in integration density and produces smaller, faster and more power-efficient chips than is possible with conventional technologies.
Contact(s) for the Press kit
Michael Loughran
IBM Media Relations
914-945-1613
mloughra@us.ibm.com