IBM Global Procurement purchases goods and services through three major areas: General Procurement, Systems Production Procurement and Technology Group Procurement.
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Consulting/professional services performed in the areas of business consulting, market intelligence, education, and Human Resources benefit and support programs.
Complementary workforce services
All services that primarily require administrative or clerical activities to be performed by a contractor such as temporary staffing for call centers, help desk, mail rooms, reproduction services, graphics, drafting or other temporary administrative services.
All networking hardware and services including networked storage and wireless LAN, copper and fiber optic cabling materials and installation services, telephone hardware and services, and uninterruptible power supplies.
Facilities services solutions
The Facilities Services Solutions councils are chartered with establishing a global strategy and the resulting supplier relationships to fulfill requirements within IBM internally for the following:
Active, Optic, Passive (AOP) electronic components used in the production of IBM hardware. Some examples of AOP components are: resistors, capacitors, inductors, discrete optics, diodes, transistors, oscillators, crystals, and rectifiers.
Cables, connectors, fiber optics, and harnesses used in the production of IBM hardware.
Electronic card assembly and test (ECAT)
ECAT is the compilation of various electronic components that when integrated on a printed circuit card make a sub assembly which performs specific functions in a higher level assembly or finished product. The functionality may include logic, memory and features.
Liquid crystal displays (LCDs)
Complete LCD units
Logic - CPU, core logic chipsets
Industry standard x86 microprocessors (CPU) and core chipsets that support multiple brands (System x, RSS, storage).
Logic - standard and custom
Microprocessors and logic semiconductor electronic components including microcontrollers, MPUs, clocks, DSP, network products, peripherals/controllers, ASICs, PLD/FPGA, linears and VTL.
Mechanicals: fabricated metals and plastics
Fabricated metal componentry ranging in scope from individual parts to high-level integrated mechanical packages. Plastics include resin purchases and plastic processed parts.
Memory units and modules including DRAMs, SRAMs, and EPROMs.